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TML|6490|Features Intel Core 2 Duo Processor

Supports Intel^® Core™ 2 Duo processors in a PICMG 1.3 form factor
Excellent power-per-watt efficiency with a passive CPU heatsink
Supports Graphics-class backplanes with a x16 PCI Express lane
Product lifecycle of 5 to 7+ years with an industry leading 5-year warranty

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»Designed for low-voltage applications where power efficiency is a prime consideration
»Passive heat sink solution provides excellent shock and vibration results
»Stable long-life product cycle and a 5-year factory warranty
»This SHB supports PCIe, PCI-X, PCI or ISA option cards plus additional PCIe, PCI-X and PCI card combinations on other Trenton backplanes
»Graphics-class board with PCI Express x16 and x4 lane support for the backplane devices and option card slots
»Product is designed, manufactured and supported by Trenton at our U. S. facilities

FORM FACTOR

PICMG 1.3 Graphics Class (PCI Express links = one x16 and one x4 or four x1)

PROCESSORS

Intel® Core™ 2 Duo Processor T7400 - Dual-core, 2.16GHz, 667MHZ FSB, 4MB L2 cache
Intel® Core™ Duo Processor T2500 - Dual-core, 2.0GHz, 667MHZ FSB, 2MB L2 cache

*other processor options are available with non-embedded support

BIOS (FLASH)

AMI AMIBIOS® 8

CHIPSET

The Intel® 945G Chipset with the Intel® ICH7R I/O Controller Hub

MEMORY

4GB (Max), Dual channel DDR2-667 interface with two sockets

VIDEO INTERFACE

Intel® Graphics Media Accelerator 950

ETHERNET INTERFACES

Intel® 82563EB Ethernet controller - Two 10/100/1000Base-T on I/O bracket connector
Intel® 82562G Ethernet controller - One 10/100 Base-T interface routed to SHB edge connector "C"

ON-BOARD INTERFACES

Eight USB 2.0 ports - Two I/O bracket, Two routed to SHB edge connector "C", Four via on-board header

Four SATA II/300 interfaces with RAID 0, 1, 5 and 10 support - four on board headers

One Ultra ATA/100 interface

BATTERY

Lithium - CMOS data retention

MECHANICAL

TML Dimensions = 13.330" (33.858cm) L x 4.976" (12.639cm) H
Passive Cooling Solution Height = .78" (1.98cm)
Active Cooling Solution Height Range = 1.18" (3.00cm) to 1.34" (3.39cm)

AGENCY APPROVALS & COMPLIANCE

Designed for UL60950, CAN/CSA C22.2 No. 60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

MEAN TIME BETWEEN FAILURES (MTBF)

MTBF = 198,407 Power-On Hours (POH) at 40 Cº per Belcore

POWER REQUIREMENTS - 100% stressed

100% Stressed via MS Windows HCT's System Stress

CPU	+5V	+12V	+3.3V
2.16GHz^†	3.00A	3.20A	2.60A
2.0GHz*	3.00A	2.00A	2.60A

POWER REQUIREMENTS - Idle

Typical Values - System Idling In Windows XP Desktop

CPU	+5V	+12V	+3.3V
2.16GHz	2.20A	1.70A	2.60A
2.0GHz	2.20A	0.75A	2.60A

*Check Technical Reference Manual for additional processor speeds and system parameters/notes.

OPERATING TEMPERATURE

Operating Temperature:	0° to 55° C.
Airflow Requirement:	350LFM continuous airflow when using the passive heat sink
Storage Temperature:	-20° to 70° C.
Humidity:	5% to 90% non-condensing