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SLI|6521|Features the Dual-Core Intel Xeon Processor

PICMG form factor supports one Dual-Core Intel^® Xeon^® LV processor
Perfect for low power, extended temperature applications
Performance of a quad-core Intel^® Xeon^® LV processor at lower price point
Low-profile passive heatsink, 8GB memory support and dual SATA ports
Product lifecycle of 5-7+ years with an industry leading 5-year warranty

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»Designed for low voltage, higher operating temperature environments
»Supports a Dual-Core Intel^® Xeon^® LV processor with a passive heat sink solution
»Server-Class SHB with two PCI-Express x8 lanes and one PCIe x4 lane supporting backplane card slots and I/O
»On-board I/O interfaces including dual Gigabit Ethernet ports and a video interface
»Product is designed, manufactured and supported by Trenton at our U. S. facilities

FORM FACTOR

PICMG 1.3 Server Class (PCI Express links- Two x8 and One x4 or Four x1)

PROCESSORS

One, Dual-Core Dual Intel® Xeon® LV Processor with 667MHz FSB, 2MB L2 cache

BIOS (FLASH)

AMI AMIBIOS® 8

CHIPSET

Intel® E7520 with the Intel® E6300ESB I/O Controller Hub

MEMORY

8GB (max), dual-channel DDR2-400 interface with four sockets

VIDEO INTERFACE

ATI® RAGE™ MOBILITY™ M1 video controller, 8MB integrated memory supports pixel resolutions up to 1600 x 1200 (UXGA)

ETHERNET INTERFACES

Intel® 82546EB Gigabit Ethernet Controller - Two 10/100/1000 Base-T Ethernet interfaces on I/O bracket

ON-BOARD INTERFACES

Four USB 2.0 ports - Two via I/O bracket ports, Two via on-board headers or Two routed to SHB edge connector "C"

Two SATA I/150 interfaces available via on-board headers

Two Ultra/ATA 100 interfaces

WATCHDOG TIMER

The I/O Controller Hub features an integrated, two stage Watchdog timer with programmable reset ranges of 1ms up to 10 minutes.

BATTERY

Lithium-CMOS data retention

MECHANICAL

SLI Dimensions = 13.330" (33.858cm) L x 4.976" (12.639cm) H
Passive Cooling Solution Height = 0.76" (19.30mm)
Active Cooling Solution Height Range = 1.26" (32.00mm) to 1.41" (35.88mm)

AGENCY APPROVALS & COMPLIANCE

UL60950, CAN/CSA C22.2 No. 60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

MEAN TIME BETWEEN FAILURES (MTBF)

MTBF = 227,929 Power-On Hours (POH) at 40 C per Belcore

POWER REQUIREMENTS - 100% stressed

Typical Values - 100% Stressed via MS Windows HCT's System Stress

CPU	+5V	+12V	+3.3V
2.0GHz	3.00A	2.60A	3.25A
1.66GHz	3.00A	2.20A	3.25A

-12V @ <100mA
Tolerance for all voltages is +/- 5% and must be applied by the PICMG 1.3 backplane to edge connector C.

POWER REQUIREMENTS - Idle

Typical Values - System Idling In Windows XP Desktop

CPU	+5V	+12V	+3.3V
2.0GHz	3.00A	1.65A	3.00A
1.66GHz	3.00A	1.30A	3.00A

-12V @ <100mA
Tolerance for all voltages is +/- 5% and must be applied by the PICMG 1.3 backplane to edge connector C.

OPERATING TEMPERATURE

Operating Temperature:	0° to 60° C.
Storage Temperature:	-40° to 70° C.

ENVIRONMENTAL

Airflow Requirements: Must provide 350LFM of continuous airflow across the length of the SHB when using the PASSIVE cooling solution. When using an ACTIVE cooling solution the chassis needs to deliver 100LFM of continuous airflow across the SHB.

Humidity: 5% to 90% non-condensing

Storage: -40° to 70°C

SYSTEM HARDWARE MONITOR

Monitor Fan Speed and Temperature

DATASHEET

Datasheet for SLI, Dual Core Xeon CPU, PICMG 1.3

PRODUCT MANUAL

Manual for the SLI, Dual Core Xeon, PICMG 1.3

DRIVERS

Chipset Update Software

Network & Server Adapters

ATI Rage Mobility M1 Video Controllers

BLOCK DIAGRAM

SLI Block Diagram