BPC7009 | PCI Express Gen 2 Backplane | PICMG 1.3 System Host Boards

14-slot form factor supports one PICMG 1.3 SHB and PCI Express Gen 2.0 or Gen 1.1 option cards

PICMG 1.3 Combo, Server or Graphics Class

Server or Graphics:  Three PCIe x8 (x16 mechanical), seven PCIe x4 (x8 mechanical) slots driven directly from the SHB plus one additional x8 mechanical slot driven with either a x4 or x1 PCIe link from an IOB33 module.

Note 1: Optional IOB33 module required to provide a x1 or x4 PCIe electrical link to backplane slot PCIe5.  Link width depends on system host board.

Note 2: Optional PEX10 module provides additonal PCIe Gen 2.0 bandwidth to the backplane when used on the Trenton JXT6966 SHB. 

Board dimensions: 12.3” x 12.9”

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

ATX/EPS power source - one right angle or vertical 24-position ATX/EPS connector

+12V AUX power source - one right angle or vertical 8-position connector

Extended power source - one 10-position terminal block to supply additional power if needed

+5V, +5V AUX, +12V, and +3.3V power connection and status.

• Combo-class models - JXT6966, JXTS6966

• Server-class models - MCXT, MCXT-E, NLT, SLT, MCXI, NLI, SLI

• Graphics-class models - MCGT, MCGT-E, MCGI, TQ9, TML

Operating Temp:  0°C to 60°C

Storage Temp: -40° to 70°C

Humidity: 5% to 90% non-condensing

Trenton's BPC7009 is a lead free, RoHS compliant backplane.