BPC7041 | PICMG 1.3 Backplane | PCI Express 2.0 Backplane

14-slot form factor supports one JXT6966 PICMG 1.3 SHB and up to ten PCI Express Gen 2.0 or Gen 1.1 option cards

Trenton JXT6966 PICMG 1.3 system host board with optional PEX10 and IOB33 plug-in modules

Server or Graphics:  Nine PCIe x4 (x16 mechanical) plus one PCIe x1 (x8 mechanical) slots driven directly from the SHB.

Note 1: Optional IOB33 module required to provide a x1 PCIe electrical link to backplane slot PCIe5.  The x1 PCIe link width is established by the JXT6966 system host board.  Backplane slot PCIe5 is a PCIe 1.1 interface only.

Note 2: Optional PEX10 module provides PCIe Gen 2.0 links from processor two of the Trenton JXT6966 SHB to BPC7041 backplane slots PCIe1 through PCIe4.

Note 3: Backplane slot PCIe10 is a PCIe 1.1 slot only.

Note 4: Backplane slots PCIe1 through PCIe4 and PCIe6 through PCIe9 may operate as either PCIe 2.0 or PCIe 1.1 slots depending on the end point devices connected to these slots.

Board dimensions: 12.3” x 12.9” with a minimum drive tower cut-out of 13.41 square inches

The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process.

Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994

ATX/EPS power source - one vertical 24-position ATX/EPS connector

+12V AUX power source - one vertical 8-position connector

Extended power source - one 10-position terminal block to supply additional power if needed

+5V, +5V AUX, +12V, and +3.3V power connection and status.

• Combo-class model - JXT6966

Operating Temp:  0°C to 60°C

Storage Temp: -40° to 70°C

Humidity: 5% to 90% non-condensing

Trenton's BPC7041 is a lead free, RoHS compliant backplane.