BPG8032 | PICMG 1.3 | 20-Slot | Video Processing & GPU Backplane
- Enables scalable video display walls and robust GPU computing solutions
- Backplane supports multiple video wall controller and NVIDIA® GPU cards
- Features seventeen x16 PCI Express 2.0 electrical interfaces
- Eighteen total PCIe 2.0 slots all use x16 mechanical card connectors
*See the Configuration section under the Tech Spec tab for slot interface Suggested SHBs Trenton models - JXT6966, JXTS6966, TSB7053, TQ9 and TML FORM FACTOR 20-slot form factor supports one combo or graphics-class, PICMG 1.3 SHB and up to eighteen PCI Express Gen 2.0 or Gen 1.1 option cards. All card slots use x16 PCIe mechanical connectors and seventeen of these slots are driven with x16 PCIe 2.0 electrical interfaces. SHB CONFIGURATION Any combo or graphics-class PICMG 1.3 system host board including Trenton's JXT6966, JXTS6966, TSB7053, TQ9 or TML. An optional IOB33 or IOB31 plug-in module is not required for use with the BPG8032 backplane. CONFIGURATION Graphics: Seventeen PCIe x16 and one PCIe x4 (all x16 mechanical) slots Note 2: Backplane slot PCIe1 is driven with a x4 PCI Express electrical interface direct from the SHB. PCIe1 operates as a PCIe 2.0 slot when both the SHB and the end-point device support the Gen 2 interface. Note 3: Video, graphics or GPU cards with a x16 PCI Express electrical interface should be connected into backplane slots PCIe2 through PCIe18 to take full advantage of the x16 link speed. Note 4: The total stack-up height of the SHB's cooling solution and/or the placement of the cooling solution on the SHB may cause an interference issue when trying to plug option cards into either BPG8032 backplane slot PCIe1 and/or PCIe2. This potential interference may prevent the usage of one or both of these slots in some applications. MECHANICAL Board dimensions: 16.4” x 12.9” The nominal backplane thickness is 0.080”; however, the backplane mounting holes are recessed 0.018” on the bottom to provide an effective PCB thickness of 0.062” for use in the chassis design process. AGENCY APPROVALS & COMPLIANCE Designed for UL60950 and CAN/CSA C22.2 No.60950-00, EN55022:1998 Class B, EN61000-4-2:1995, EN61000-4-3:1997, EN61000-4-4:1995, EN61000-4-5:1995, EN61000-4-6:1996, EN61000-4-11:1994 POWER CONNECTORS ATX/EPS power source - one right-angle or vertical 24-position ATX/EPS connector +12V AUX power source - five right-angle or vertical 8-position connectors POWER INDICATORS +5V, +5V AUX, +12V, and +3.3V power connection and status ENVIRONMENTAL Operating Temp: 0°C to 60°C Storage Temp: -20° to 70°C Humidity: 5% to 90% non-condensing Trenton's BPG8032 is a lead free, RoHS compliant backplane. DATASHEET MECHANICAL DRAWINGS BLOCK DIAGRAM CONFIGURATION DETAILS
Compatible Single Board Computers PICMG 1.3
|
|||||||||||||||||
